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제품소개
New Product
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WS-100
제품소개
Semiconductor Bonder
Semiconductor Chip Bonder
Lidar Chip Bonder
Wafer Bonder
Micro LED Bonder
Chip Bonder
FCBGA Bump Flattening
Bump Flattening Machine(Auto)
Bump Flattening Machine(Semi-Auto)
Bump Flattening Machine(Manual)
Wafer & Lead Tap Inspection
Wafer Visual Inspection system
Lead Tap Inspection system
Wafer Transfer System
Wafer Cleaner
4-Zone Wafer Cleaner
Hot DIW Wafer Cleaner
Wafer Spin Coater
Vacuum Lamination
PCB Vacuum Lamination(Auto)
PCB Vacuum Lamination(Semi-Auto)
FA system
LU-100
LPP-100
Handler Automation
DC Test Handler(Semi-Auto)
Test Handler
DC Test Handler(Auto)
Other machine
Cellulose Packing System
New Product
PR Filling Machine
Wafer Vacuum Sealing Machine