Bump Flattening Machine(Auto)

Semiconductor Bonder
FCBGA Bump Flattening
Wafer & Lead Tap Inspection
Wafer Cleaner
Vacuum Lamination
- PCB Vacuum Lamination(Auto)
- PCB Vacuum Lamination(Semi-Auto)
FA system
- LU-100
- LPP-100
Handler Automation
Other machine
- Cellulose Packing System
New Product
- PR Filling Machine
- Wafer Vacuum Sealing Machine

(주)브로젠 I 대표자 : 정라파엘 I 소재지 : 경기도 화성시 동탄첨단산업1로 51-9, 동탄엠타워 307호
TEL : 070-4820-1532 I FAX : 031-8014-2510 I E-mail : brozen@brozen.co.kr